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SCEJ 84th Annual Meeting (Tokyo, 2019)

Last modified: 2019-03-12 11:30:00

Program search result : PIA : 5 programs

The preprints(abstracts) can be viewed by clicking the Paper IDs.
The ID/PW printed on the PROGRAM book are required.
(The ID/PW have also been sent to the Earlybird registers and invited persons by e-mail.)
The programs of HC-13, HC-17, K-1 were updated.

Affillations (J) field begins with “PIA”; 5 programs are found.
The search results are sorted by the start time.

TimePaper
ID
Title / AuthorsKeywordsTopic codeAck.
number
Day 2
11:4012:00
G209Numerical analysis of liquid phase penetration into fine powder bed
(PIA) *(Reg)Koike O., (U. Tokyo) (Reg)Tatsumi R., (PIA) (Reg)Yamaguchi Y.
liquid penetration
fine powder bed
multiphase simulation
12-a34
Day 2
16:4017:00
F224Separating behavior of piled particles of cake layer in shear flow field
(Nihon U.) *(Reg)Ando T., (Stu)Fujihira T., (PIA) (Reg)Koike O., (U. Tokyo) (Reg)Tatsumi R.
Separation of piled particles
Shear flow field
Numerical simulation
4-a1077
Day 3
13:0013:20
H313Structure control based on the drying characteristics of colloidal suspensions
(U. Tokyo) *(Reg)Tatsumi R., (PIA) (Reg)Koike O., (Reg)Yamaguchi Y., (U. Tokyo) (Reg)Tsuji Y.
Colloidal suspension
Drying characteristics
Numerical simulation
12-h191
Day 3
13:2013:40
H314Numerical simulation of effects of solvent and modifier on structure formation of surface-modified nanoparticles during solvent evaporation
(Tohoku U.) *(Stu·PCEF)Usune Shin, (Stu·PCEF)Takahashi Tarou, (Reg)Kubo Masaki, (Reg)Shoji Eita, (Reg)Tsukada Takao, (PIA) (Reg)Koike Osamu, (U. Tokyo) (Reg)Tatsumi Rei, (Josai U.) (Reg)Fujita Masahiro, (Tohoku U.) (Reg)Adschiri Tadafumi
numerical simulation
surface-modified nanoparticles
structure formation
12-h1099
Day 3
13:2015:20
PE319Effect of particle flow by presence of an obstacle on solid-liquid two-phase flow
(Nihon U.) *(Stu)Udo Kai, (Reg)Ando Tsutomu, (PIA) (Reg)Koike Osamu, (U. Tokyo) (Reg)Tatsumi Rei
Solid-liquid two phase flow
Obstacle
Promotion
2-e1075

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SCEJ 84th Annual Meeting (Tokyo, 2019)


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