Authors and Chairs (J) field exact matches “小池 修”; 3 programs are found.
The search results are sorted by the start time.
Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
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Day 2 | Chair: | ||||
I214 | Study of filler dispersion and thermal conduction mechanism of thermal grease | thermal grease thermal conduction Interfacial thermal resistance | 11-d | 20 | |
I215 | Investigating the possibility of sintering Cu paste at low temperature -2nd report- | Sintering Cu paste Necking | 11-e | 19 | |
Day 3 | J302 | A Direct numerical simulation on detachment process of particle aggregate from plane surface - effect of cohesive interaction between solids - | DNS cohesive interaction detachment of aggregate | 12-h | 563 |
Day 3 | J304 | Dynamic modulus reflecting aggregation state in aqueous slurries | rheology colloidal suspension numerical simulation | 12-l | 553 |
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SCEJ 88th Annual Meeting (Tokyo, 2023)