SCEJ 88th Annual Meeting (Tokyo, 2023)
Program search result : Thermal interface material : 2 programs
The preprints(abstracts) are now open (Mar. 1st). These can be viewed by clicking the Paper IDs. The ID/PW sent to the Registered participants in Period I/II and invited persons are required.
Keywords field exact matches “Thermal interface material”; 2 programs are found.
The search results are sorted by the start time.
| Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
|---|---|---|---|---|---|
| Day 1 | PA139 | Development of thermally-stable thermal interface material using thermosetting resin | Thermal interface material Thermosetting resin Thermal stability | 12-i | 183 |
| Day 2 | J203 | Fabrication of aligned mercaptosilane SAM modified cupper nanowire-polymer composite film and performance evaluation as thermal interface material. | Thermal Interface Material Cupper nanowire Self assembled monolayer | 12-a | 692 |
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SCEJ 88th Annual Meeting (Tokyo, 2023)
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