Last modified: 2023-12-13 19:10:32
Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
---|---|---|---|---|---|
6. Systems, information, and simulation technologies | |||||
(9:00–10:00) (Chair: | |||||
I201 | Modeling cell metabolic shifts in cultivation processes for monoclonal antibody production | Biopharmaceuticals Lactate consumption Hybrid modeling | 6-b | 394 | |
I202 | Solvent selection based on solvent recycling to improve chemical process | Solvent selection Process design Solvent recycling | 6-b | 449 | |
I203 | Model-based characterization and evaluation of batch and flow syntheses in drug substance manufacturing | Design space Kinetic model Hybrid model | 6-b | 123 | |
(10:20–11:20) (Chair: | |||||
I205 | Proposal of a method to improve the performance of MSPC by appropriate standardization of input variables and its application to continuous pharmaceutical manufacturing | Multivariate Statistical Process Control Continuous Pharmaceutical Manufacturing Wet Granulation | 6-d | 68 | |
I206 | A comprehensive design approach for injectable manufacturing processes considering new technologies and operational aspects | Process design Multiobjective evaluation Pareto frontier | 6-b | 171 | |
I207 | [Featured presentation] Prediction of Olefin Metathesis Reactivity Using Machine-Learning Model | machine-learning olefin metathesis catalytic reaction | 6-d | 69 | |
14. Wide area | |||||
(11:20–11:40) (Chair: | |||||
I208 | Practice of chemistry-related educational events under the coexistence with the new coronavirus (COVID-19) and analysis of request trends in the practice results | chemistry-related educational events with the new coronavirus (COVID-19) new life stile | 14-c | 102 | |
11. Electronics | |||||
(13:20–14:00) (Chair: | |||||
I214 | Study of filler dispersion and thermal conduction mechanism of thermal grease | thermal grease thermal conduction Interfacial thermal resistance | 11-d | 20 | |
I215 | Investigating the possibility of sintering Cu paste at low temperature -2nd report- | Sintering Cu paste Necking | 11-e | 19 |
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SCEJ 88th Annual Meeting (Tokyo, 2023)