SCEJ 88th Annual Meeting (Tokyo, 2023)
Last modified: 2023-12-13 19:10:32
Session programs : 11. Electronics : I214
The preprints(abstracts) are now open (Mar. 1st). These can be viewed by clicking the Paper IDs. The ID/PW sent to the Registered participants in Period I/II and invited persons are required.
11. Electronics
Hall I, Day 2
Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
Hall I, Day 2 |
(13:20–14:00) (Chair: Koike Osamu, Tamura Kenji) |
13:20– 13:40 | I214 | Study of filler dispersion and thermal conduction mechanism of thermal grease
(Sumitomo Metal Mining) *(Cor)Ogawa Takahiro, (Cor)Kashiwaya Satoshi, (Cor)Ueda Takahiro | thermal grease thermal conduction Interfacial thermal resistance
| 11-d | 20 |
13:40– 14:00 | I215 | Investigating the possibility of sintering Cu paste at low temperature -2nd report-
(Sumitomo Metal Mining) *(Cor)Hanzawa Kazuki, (Cor)Kashiwaya Satoshi | Sintering Cu paste Necking
| 11-e | 19 |
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SCEJ 88th Annual Meeting (Tokyo, 2023)
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