SCEJ 88th Annual Meeting (Tokyo, 2023)
Last modified: 2023-12-13 19:10:32
Session programs : 11. Electronics : I214
The preprints(abstracts) are now open (Mar. 1st). These can be viewed by clicking the Paper IDs. The ID/PW sent to the Registered participants in Period I/II and invited persons are required.
11. Electronics
| Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
|---|---|---|---|---|---|
| Hall I, Day 2 | |||||
| (13:20–14:00) (Chair: | |||||
| I214 | Study of filler dispersion and thermal conduction mechanism of thermal grease | thermal grease thermal conduction Interfacial thermal resistance | 11-d | 20 | |
| I215 | Investigating the possibility of sintering Cu paste at low temperature -2nd report- | Sintering Cu paste Necking | 11-e | 19 | |
| DispCtl: |
|---|
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SCEJ 88th Annual Meeting (Tokyo, 2023)
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