List of received applications (By symposium/topics code) | SCEJ 90th Annual Meeting

TUS

Application

List of received applications (By symposium/topics code)

Top > Application > List of received applications (By symposium/topics code)

11) Electronics

11-e. Interconnection (adhesion, bonding, etc.)

Most recent update: 2025-02-24 00:14:01

The keywords that frequently used in this topics code.	Keywords	Number
	copper	1
	complex	1
	sintering	1

ACKN No.	Title/Author(s)	Keywords	Style
294	Investigating the possibility of sintering Cu paste at low temperature (Sumitomo Metal Mining) *(Cor)Toriyama Takahiro, (Cor)Kashiwaya Satoshi	copper sintering complex	O

List of received applications (By topics code)

List of received applications
SCEJ 90th Annual Meeting (Tokyo, 2025)

Organizing Committee of SCEJ 90th Annual Meeting (2025)
Inquiry

General Information	Site Top \| General Information \| On-site Access \| Online Meeting Site \| Ceremony \| IChES 2025 \| Inquiry
Program	Program \| Hall map \| Symposia \| Ceremony
Registration	Registration \| Free registration
Application	Submission & Appl. \| Topics code list \| Application Form[Closed] \| Appl. Form sample \| Appl. correction[Closed] \| View Application Data \| Presentation & Poster Guide
Preprint	Preprint Preparation \| Preprint Submission form