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List of received applications (By symposium/topics code)

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11) Electronics

11-e. Interconnection (adhesion, bonding, etc.)

Most recent update: 2025-08-14 16:14:01

The keywords that frequently used in this topics code.	Keywords	Number
	copper	1
	sintering	1
	complex	1

ACKN No.	Title/Author(s)	Keywords	Style
294	Investigating the possibility of sintering Cu paste at low temperature (Sumitomo Metal Mining) *(Cor)Toriyama Takahiro, (Cor)Kashiwaya Satoshi	copper sintering complex	O

List of received applications (By topics code)

List of received applications
SCEJ 90th Annual Meeting (Tokyo, 2025)

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