SCEJ 55th Autumn Meeting
Sep. 11 (Wed) - 13 (Fri), 2024
Sapporo Campus, Hokkaido University
Japanese page
SCEJ 55th Autumn Meeting
Sep. 11 (Wed) - 13 (Fri), 2024
Sapporo Campus, Hokkaido University
Japanese page
This symposium widely accept papers of the electronic materials and process technologies, containing electroplating, batteries, semiconductor crystals, polymers and any relating issues.
Most recent update: 2024-07-02 01:34:01
 The keywords that frequently used in this topics code. | Keywords | Number | |
|---|---|---|---|
| Copper non-woven fabrics | 1 |  | |
| PECVD | 1 | | |
| SiCxNyOz | 1 | | |
| semiconductor process | 1 | | |
| Resist | 1 | | |
| Power module assembly | 1 | | |
| cycloolefin polymer | 1 | | |
| Diamond device | 1 | | |
| Semiconductor Industry | 1 | | |
| copper seed layer | 1 | | |
| TOF-SIMS | 1 | | |
| Barrier film | 1 | | |
| Copper nanowire | 1 | | |
| Flexible electrodes | 1 | | |
| Wet process | 1 | | |
| ACKN No. | Title/Author(s) | Keywords | Style |
|---|---|---|---|
| 10 | [Review lecture] | Resist semiconductor process | O |
| 11 | [Invited lecture] Development of Ultra-High Barrier Film by Solution Process | Barrier film Wet process | O |
| 12 | [Invited lecture] | Diamond device | O |
| 20 | [Review lecture] | Semiconductor Industry | O |
| 203 | Precursor contribution to SiCxNyOz PECVD | PECVD SiCxNyOz | O |
| 328 | Investigation of adhesion mechanism between cycloolefin polymer and copper plating layer with copper seed layer using TOF-SIMS | TOF-SIMS copper seed layer cycloolefin polymer | O |
| 336 | Mechanical Characterization of Copper Nonwoven Electrodes Fabricated from Copper Nanowires | Copper non-woven fabrics Copper nanowire Flexible electrodes | O |
| 438 | Development for Power Module Assembly | Power module assembly | O |
Organizing Committee of SCEJ 55th Autumn Meeting (2024)
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