
Last modified: 2026-07-16 06:38:20
| Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
|---|---|---|---|---|---|
| ST-27 [Trans-Division Symposium] CVD/ALD & Dry Process, Control of Structure and unction of material by reaction engineering | |||||
| (13:20–16:00) | |||||
| G114 | [Review lecture] What is the “cutting edge of semiconductor devices”? Considering this from the history of 3D device | Semiconductor Logic Memory | ST-27 | 347 | |
| G116 | Control of a High-Speed Switching Valve for On-Demand Precursor Delivery in ALD II : Analysis of Flow Rate Response | Atomic Layer Deposition Sustainable Valve | ST-27 | 679 | |
| G117 | Study on Low-Temperature AlN Deposition and Enhancement of Thermal Conductivity via TMA/NH3-Based FM-CVD (2) Effect of Grain Size | AlN CVD 3DIC | ST-27 | 828 | |
| Break | |||||
| G119 | Fabrication and Evaluation of B- and Mo-Doped TiCN Films by DC Plasma CVD | DC plasma CVD TiSiCN | ST-27 | 943 | |
| G120 | [Invited lecture] Introduction of a case study of optimizing the thin-film deposition process using AI tools developed by TEL | AI tools ALD/CVD Process informatics | ST-27 | 211 | |
| G121 | [Invited lecture] From Property Measurement to AI-Based Property Prediction: New Developments in Thermodynamic Research | Thermodynamic Properties Machine Learning Phase Equilibria | ST-27 | 97 | |
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SCEJ 57th Autumn Meeting (Higashihiroshima, 2026)
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