
Last modified: 2024-09-19 02:24:28
| Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
|---|---|---|---|---|---|
| SY-77 [Symposium of Division of Electronics] Electronics Materials and Processes | |||||
| (9:00–10:00) (Chair: | |||||
| C201 | [Review lecture] | Resist semiconductor process | SY-77 | 10 | |
| C203 | [Invited lecture] Development of Ultra-High Barrier Film by Solution Process | Barrier film Wet process | SY-77 | 11 | |
| (10:00–11:20) (Chair: | |||||
| C204 | [Invited lecture] | Diamond device | SY-77 | 12 | |
| Break | |||||
| C206 | [Review lecture] | Semiconductor Industry | SY-77 | 20 | |
| HQ-12 Women Engineers Network | |||||
| (12:10–13:00) (Chair: | |||||
| C211 | [Invited lecture] Development of optofunctional materials and work as life in my laboratory | photocatalyst inorganic material life-work balance | HQ-12 | 170 | |
| C212 | [Invited lecture] Current status and issues of gender equality in the Society of Chemical Engineers, Japan | TBD | HQ-12 | 169 | |
| SY-77 [Symposium of Division of Electronics] Electronics Materials and Processes | |||||
| (13:20–14:00) (Chair: | |||||
| C214 | Precursor contribution to SiCxNyOz PECVD | PECVD SiCxNyOz | SY-77 | 203 | |
| C215 | Investigation of adhesion mechanism between cycloolefin polymer and copper plating layer with copper seed layer using TOF-SIMS | TOF-SIMS copper seed layer cycloolefin polymer | SY-77 | 328 | |
| (14:00–14:40) (Chair: | |||||
| C216 | Mechanical Characterization of Copper Nonwoven Electrodes Fabricated from Copper Nanowires | Copper non-woven fabrics Copper nanowire Flexible electrodes | SY-77 | 336 | |
| C217 | Development for Power Module Assembly | Power module assembly | SY-77 | 438 | |
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SCEJ 55th Autumn Meeting (Sapporo, 2024)
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